Invention Application
- Patent Title: METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
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Application No.: US17086179Application Date: 2020-10-30
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Publication No.: US20220139872A1Publication Date: 2022-05-05
- Inventor: Che-Ting LIU , Jheng-Yu HONG , Yu-Ting LU , Po-Chun LEE , Chih-Hsiang HSU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; H01L21/683 ; H01L21/56 ; H01L21/78 ; H01L23/544
Abstract:
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
Public/Granted literature
- US11538787B2 Method and system for manufacturing a semiconductor package structure Public/Granted day:2022-12-27
Information query
IPC分类:
