公开(公告)号：US20230138460A1

公开(公告)日：2023-05-04

申请号：US18089458

申请日：2022-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting LIU ,  Jheng-Yu HONG ,  Yu-Ting LU ,  Po-Chun LEE ,  Chih-Hsiang HSU

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/544 ,  H01L21/67

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

公开(公告)号：US20210074664A1

公开(公告)日：2021-03-11

申请号：US16565158

申请日：2019-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20220139872A1

公开(公告)日：2022-05-05

申请号：US17086179

申请日：2020-10-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting LIU ,  Jheng-Yu HONG ,  Yu-Ting LU ,  Po-Chun LEE ,  Chih-Hsiang HSU

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/56 ,  H01L21/78 ,  H01L23/544

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

公开(公告)号：US20190206843A1

公开(公告)日：2019-07-04

申请号：US16297470

申请日：2019-03-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao LYU ,  Chieh-Ju TSAI ,  Yu-Kai LIN ,  Wei-Ming HSIEH ,  Yu-Pin TSAI ,  Man-Wen TSENG ,  Yu-Ting LU

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/28

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/28 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/83

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

公开(公告)号：US20240063163A1

公开(公告)日：2024-02-22

申请号：US18498931

申请日：2023-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L24/05 ,  H01L23/295 ,  H01L23/49838 ,  H01L24/25 ,  H01L25/105 ,  H01L21/6836 ,  H01L21/78 ,  H01L21/565 ,  H01L24/19 ,  H01L24/97 ,  H01L23/49827 ,  H01L2924/35121 ,  H01L2221/68381 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2224/2518 ,  H01L2224/24226

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20210407951A1

公开(公告)日：2021-12-30

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20180061727A1

公开(公告)日：2018-03-01

申请号：US15675612

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao LYU ,  Chieh-Ju TSAI ,  Yu-Kai LIN ,  Wei-Ming HSIEH ,  Yu-Pin TSAI ,  Man-Wen TSENG ,  Yu-Ting LU

IPC: H01L23/28 ,  H01L23/498 ,  H01L23/427 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/28 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/83

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.