Invention Application
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING SURFACE-TREATED SEMICONDUCTOR LAYER
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Application No.: US17405619Application Date: 2021-08-18
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Publication No.: US20220140100A1Publication Date: 2022-05-05
- Inventor: Yeonchoo CHO , Kyung-Eun BYUN , Hyeonjin SHIN
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0147086 20201105
- Main IPC: H01L29/45
- IPC: H01L29/45

Abstract:
Disclosed is a semiconductor device including a surface-treated semiconductor layer. The semiconductor device includes a metal layer, a semiconductor layer electrically contacting the metal layer and having a surface treated with an element having an electron affinity of about 4 eV or greater, and a two-dimensional (2D) material layer disposed between the metal layer and the semiconductor layer and having a 2D crystal structure.
Public/Granted literature
- US12046656B2 Semiconductor device including surface-treated semiconductor layer Public/Granted day:2024-07-23
Information query
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