Invention Application
- Patent Title: LIGHT SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
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Application No.: US17212362Application Date: 2021-03-25
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Publication No.: US20220140172A1Publication Date: 2022-05-05
- Inventor: WEN-CHIEH TSOU , YI-HUA CHANG
- Applicant: SENSORTEK TECHNOLOGY CORP.
- Applicant Address: TW Zhubei City
- Assignee: SENSORTEK TECHNOLOGY CORP.
- Current Assignee: SENSORTEK TECHNOLOGY CORP.
- Current Assignee Address: TW Zhubei City
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L27/146 ; H01L33/62 ; H01L23/552

Abstract:
A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.
Information query
IPC分类: