Invention Application
- Patent Title: SUBSTRATE THINING USING TEMPORARY BONDING PROCESSES
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Application No.: US17515630Application Date: 2021-11-01
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Publication No.: US20220140227A1Publication Date: 2022-05-05
- Inventor: Indrani Bhattacharyya , Julia Anne Dorothee Brueckner , Ya-Huei Chang , Bokyung Kong , Prantik Mazumder , Jun Ro Yoon , Jian-Zhi Jay Zhang
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Priority: NL2027189 20201221
- Main IPC: H01L41/312
- IPC: H01L41/312 ; H01L41/337 ; H01L41/187 ; H01L41/08
Abstract:
An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.
Information query
IPC分类:
