Invention Application
- Patent Title: MULTI-CHIP PHOTONIC NODE FOR SCALABLE ALL-TO-ALL CONNECTED FABRICS
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Application No.: US17086044Application Date: 2020-10-30
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Publication No.: US20220141557A1Publication Date: 2022-05-05
- Inventor: KEVIN B. LEIGH , LUCA RAMINI , MIR ASHKAN SEYEDI , STEVEN DEAN , MARCO FIORENTINO
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Main IPC: H04Q11/00
- IPC: H04Q11/00 ; G02B6/43

Abstract:
A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.
Public/Granted literature
- US11323787B1 Multi-chip photonic node for scalable all-to-all connected fabrics Public/Granted day:2022-05-03
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