公开(公告)号：US20220077656A1

公开(公告)日：2022-03-10

申请号：US17015001

申请日：2020-09-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： DI LIANG ,  CHIH C. SHIH ,  KEVIN B. LEIGH ,  GEZA KURCZVEIL ,  MARCO FIORENTINO

IPC: H01S5/183 ,  H01S5/024 ,  H01S5/10

Abstract: Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.

公开(公告)号：US20220120983A1

公开(公告)日：2022-04-21

申请号：US17074472

申请日：2020-10-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： KEVIN B. LEIGH ,  LUCA RAMINI ,  MIR ASHKAN SEYEDI ,  MARCO FIORENTINO

IPC: G02B6/42 ,  G02B6/293

Abstract: An photonic circuit includes a substrate, a plurality of first light waveguides disposed on the substrate, the first light waveguides extending in a first direction, a plurality of second light waveguides disposed on the substrate and extending in a second direction intersecting the first direction, and a plurality of first micro-ring resonators disposed on the substrate. Each of the first light waveguides has an intersection with each of the second light waveguides. Each of the intersections is provided with a first micro-ring resonator of the first micro-ring resonators. Each first micro-ring resonator is configured to route signals of a respective wavelength from one of the light waveguides at the intersection to another light waveguide at the intersection.

公开(公告)号：US20210373241A1

公开(公告)日：2021-12-02

申请号：US16883969

申请日：2020-05-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： PENG SUN ,  MIR ASHKAN SEYEDI ,  THOMAS VAN VAERENBERGH ,  MARCO FIORENTINO

IPC: G02B6/293

Abstract: Embodiments of the present disclosure provide etch-variation tolerant optical coupling components and processes for making the same. An etch-variation tolerant geometry is determined for at least one waveguide of an optical coupling component (e.g., a directional coupler). The geometry is optimized such that each fabricated instance of an optical component design with the etch-variation tolerant geometry has substantially the same coupling ratio at any etch depth between a shallow etch depth and a deep etch depth.

公开(公告)号：US20220141557A1

公开(公告)日：2022-05-05

申请号：US17086044

申请日：2020-10-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： KEVIN B. LEIGH ,  LUCA RAMINI ,  MIR ASHKAN SEYEDI ,  STEVEN DEAN ,  MARCO FIORENTINO

IPC: H04Q11/00 ,  G02B6/43

Abstract: A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.