Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
-
Application No.: US17573595Application Date: 2022-01-11
-
Publication No.: US20220141971A1Publication Date: 2022-05-05
- Inventor: Ming-Hung CHEN , Yung I. YEH , Chang-Lin YEH , Sheng-Yu CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/06 ; H05K1/18 ; H05K9/00 ; H05K3/28 ; H05K1/14
Abstract:
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
Public/Granted literature
- US11744024B2 Semiconductor device package and method of manufacturing the same Public/Granted day:2023-08-29
Information query
