Invention Application
- Patent Title: COOLANT THERMAL BUFFER FOR DATACENTER COOLING SYSTEMS
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Application No.: US17083554Application Date: 2020-10-29
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Publication No.: US20220142007A1Publication Date: 2022-05-05
- Inventor: Ali Heydari
- Applicant: Nvidia Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Nvidia Corporation
- Current Assignee: Nvidia Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a thermal buffer is provided to collect coolant from a plurality of coolant distribution units (CDUs), to enable thermal stability for the coolant within the thermal buffer, and to facilitate a cooling loop with one or more cooling manifolds associated with at least one computing device.
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