公开(公告)号：US12279401B2

公开(公告)日：2025-04-15

申请号：US17510057

申请日：2021-10-25

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: F25B5/02 ,  F25B41/42 ,  F25B49/02 ,  H05K7/20 ,  F25B25/00

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, multiple parallel refrigerant paths are associated with one or more flow controllers to cool multiple computing devices associated therewith, so that one or more flow controllers can distribute equal measures of a liquid phase of refrigerant, relative to a vapor phase of a refrigerant, to such parallel refrigerant paths based in part on a cooling requirement from at least one of such multiple computing devices.

公开(公告)号：US12185495B2

公开(公告)日：2024-12-31

申请号：US17729764

申请日：2022-04-26

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  B21D53/02 ,  B23P15/26 ,  F28F3/12

Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

公开(公告)号：US12101907B2

公开(公告)日：2024-09-24

申请号：US17246330

申请日：2021-04-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20281 ,  H05K7/20509 ,  H05K7/20781 ,  H05K7/20745

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

公开(公告)号：US12082382B2

公开(公告)日：2024-09-03

申请号：US17238384

申请日：2021-04-23

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/02

CPC classification number: H05K7/20836 ,  G05B13/027 ,  H05K7/20327 ,  H05K7/20354 ,  H05K7/20818

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

公开(公告)号：US20240268085A1

公开(公告)日：2024-08-08

申请号：US18629850

申请日：2024-04-08

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  F28F13/00 ,  F28F27/00

CPC classification number: H05K7/20836 ,  F28F13/00 ,  F28F27/00 ,  H05K7/20254 ,  H05K7/2079

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.

公开(公告)号：US20240215205A1

公开(公告)日：2024-06-27

申请号：US18085129

申请日：2022-12-20

Applicant: NVIDIA Corporation

Inventor： Pardeep Shahi ,  Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20645

Abstract: A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.

公开(公告)号：US11988401B2

公开(公告)日：2024-05-21

申请号：US17371878

申请日：2021-07-09

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: F24F11/49 ,  H05K7/20

CPC classification number: F24F11/49 ,  H05K7/20254 ,  H05K7/20745 ,  H05K7/2079 ,  H05K7/20836

Abstract: Systems and methods for cooling in a datacenter are disclosed. In at least one embodiment, a thermal load bank (TLB) system to test a hybrid datacenter cooling system includes one or more thermal features to generate heat within a TLB system and includes one or more hybrid cooling features to provide air and liquid cooling responses to such heat generated by one or more thermal features.

公开(公告)号：US11974416B2

公开(公告)日：2024-04-30

申请号：US17238362

申请日：2021-04-23

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06N3/04 ,  G06N3/08

CPC classification number: H05K7/20836 ,  G06N3/04 ,  G06N3/08 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20827

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.

公开(公告)号：US11950396B2

公开(公告)日：2024-04-02

申请号：US17138509

申请日：2020-12-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20254 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.

公开(公告)号：US11910577B2

公开(公告)日：2024-02-20

申请号：US17404098

申请日：2021-08-17

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/2079

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.