Invention Application
- Patent Title: MULTI-ZONE SEMICONDUCTOR SUBSTRATE SUPPORTS
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Application No.: US17583935Application Date: 2022-01-25
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Publication No.: US20220148894A1Publication Date: 2022-05-12
- Inventor: Mehmet Tugrul Samir , Dongqing Yang , Dmitry Lubomirsky , Peter Hillman , Soonam Park , Martin Yue Choy , Lala Zhu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; H01L21/687
Abstract:
Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
Public/Granted literature
- US11915950B2 Multi-zone semiconductor substrate supports Public/Granted day:2024-02-27
Information query
IPC分类:
