Invention Application
- Patent Title: LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
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Application No.: US17501568Application Date: 2021-10-14
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Publication No.: US20220148934A1Publication Date: 2022-05-12
- Inventor: Edward Fuergut , Chii Shang Hong , Teck Sim Lee , Ralf Otremba , Daniel Pedone , Bernd Schmoelzer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102020129423.9 20201109
- Main IPC: H01L23/16
- IPC: H01L23/16 ; H01L23/367 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
A package for mounting on a mounting base is disclosed. In one example, the package comprises a carrier, an electronic component mounted at the carrier, leads electrically coupled with the electronic component and to be electrically coupled with the mounting base, and a linear spacer for defining a spacing with respect to the carrier.
Public/Granted literature
- US11942383B2 Linear spacer for spacing a carrier of a package Public/Granted day:2024-03-26
Information query
IPC分类:
