Invention Application
- Patent Title: INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED STRUCTURES, DEVICES, AND METHODS
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Application No.: US17583078Application Date: 2022-01-24
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Publication No.: US20220148967A1Publication Date: 2022-05-12
- Inventor: Manish CHANDHOK , Richard SCHENKER , Tristan TRONIC
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/532

Abstract:
Integrated circuit (IC) structures, computing devices, and related methods are disclosed. An IC structure includes an interlayer dielectric (ILD), an interconnect, and a liner material separating the interconnect from the ILD. The interconnect includes a first end extending to or into the ILD and a second end opposite the first end. A second portion of the interconnect extending from the second end to a first portion of the interconnect proximate to the first end does not include the liner material thereon. A method of manufacturing an IC structure includes removing an ILD from between interconnects, applying a conformal hermetic liner, applying a carbon hard mask (CHM) between the interconnects, removing a portion of the CHM, removing the conformal hermetic liner to a remaining CHM, and removing the exposed portion of the liner material to the remaining CHM to expose the second portion of the interconnects.
Public/Granted literature
- US11837542B2 Interconnects having a portion without a liner material and related structures, devices, and methods Public/Granted day:2023-12-05
Information query
IPC分类: