Invention Application
- Patent Title: THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN FILM, THERMOSET FILM, MULTILAYER BODY, PRINTED WIRING BOARD AND METHOD FOR PRODUCING SAME
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Application No.: US17590111Application Date: 2022-02-01
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Publication No.: US20220153909A1Publication Date: 2022-05-19
- Inventor: Fumiya Kono , Masayoshi Kido
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2019-142306 20190801
- Main IPC: C08G18/10
- IPC: C08G18/10 ; C08G18/44 ; C08G73/08

Abstract:
A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). R1 and R2 in formula (1) are each independently a hydrogen atom or a methyl group. R3 in formula (1) is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure. R4 in formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.
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