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公开(公告)号：US10822465B2
公开(公告)日：2020-11-03
申请号：US15772352
申请日：2016-11-04
Applicant: KANEKA CORPORATION
Inventor： Tetsuya Kogiso , Tomohiro Koda , Masayoshi Kido
IPC: C08J7/04 , B05D7/04 , C08G18/75 , C08L75/04 , C08G18/44 , B32B27/20 , H05K3/28 , B32B27/34 , B32B17/06 , B32B27/28 , B32B15/08 , B32B7/12 , B32B27/38 , B05D3/00 , B05D7/24 , C08K5/00 , C08K5/18 , C08K5/3417 , C08K5/5313 , C08L79/08 , C09D4/00 , C09D7/63 , B05D1/02 , C09D175/04 , H05K1/03 , H05K1/02 , B05D3/10 , C09D133/10
Abstract: A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 μm or less.
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公开(公告)号：US20150195899A1
公开(公告)日：2015-07-09
申请号：US14414846
申请日：2013-07-18
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/0216 , C09D5/004 , G03F7/027 , H05K1/028 , H05K1/0373 , H05K1/0393 , H05K2201/012 , H05K2201/2054
Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
Abstract translation: 本发明提供一种导电层一体化的柔性印刷电路板，其具有优异的电绝缘可靠性，并且防止导电层在回流过程中脱离。 导电层一体化柔性印刷电路板包括：（A）电磁屏蔽导电层; （B）绝缘膜; （C）具有配线图案的膜，（A）电磁屏蔽导电层，（B）绝缘膜，（C）依次层叠配线图案膜，（B） 至少含有（a）粘合剂聚合物的绝缘体膜和（b）在红外范围内具有反射范围的黑色着色剂。
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公开(公告)号：US20220153909A1
公开(公告)日：2022-05-19
申请号：US17590111
申请日：2022-02-01
Applicant: KANEKA CORPORATION
Inventor： Fumiya Kono , Masayoshi Kido
Abstract: A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). R1 and R2 in formula (1) are each independently a hydrogen atom or a methyl group. R3 in formula (1) is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure. R4 in formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.
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公开(公告)号：US09723708B2
公开(公告)日：2017-08-01
申请号：US14414846
申请日：2013-07-18
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/0216 , C09D5/004 , G03F7/027 , H05K1/028 , H05K1/0373 , H05K1/0393 , H05K2201/012 , H05K2201/2054
Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
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公开(公告)号：US12227609B2
公开(公告)日：2025-02-18
申请号：US17590111
申请日：2022-02-01
Applicant: KANEKA CORPORATION
Inventor： Fumiya Kono , Masayoshi Kido
IPC: C09D175/12 , C08G18/10 , C08G18/44 , C08G73/08 , C09D5/44 , C09D125/08
Abstract: A thermosetting resin composition comprises a component (A) that is a compound having an imide group and a carboxy group in one molecule, and a component (B) that is a polymer having a repeating unit represented by the following general formula (1). R1 and R2 in formula (1) are each independently a hydrogen atom or a methyl group. R3 in formula (1) is a hydrogen atom or any substituent, and a plurality of R3s may be bonded to form a ring structure. R4 in formula (1) is a hydrogen atom or an alkyl group. m and n in formula (1) are each independently an integer of 1 or more, and m/n may be 1 to 50.
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Patent Agency Ranking
公开(公告)号：US20170290141A1
公开(公告)日：2017-10-05
申请号：US15629504
申请日：2017-06-21
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/0216 , C09D5/004 , G03F7/027 , H05K1/028 , H05K1/0373 , H05K1/0393 , H05K2201/012 , H05K2201/2054
Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
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公开(公告)号：US20220363892A1
公开(公告)日：2022-11-17
申请号：US17873588
申请日：2022-07-26
Applicant: KANEKA CORPORATION
Inventor： Yuichi Imamura , Masayoshi Kido , Takahiro Akinaga
IPC: C08L67/03 , C08F255/08
Abstract: A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.
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公开(公告)号：US10045433B2
公开(公告)日：2018-08-07
申请号：US15629504
申请日：2017-06-21
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/0216 , C09D5/004 , G03F7/027 , H05K1/028 , H05K1/0373 , H05K1/0393 , H05K2201/012 , H05K2201/2054
Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
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公开(公告)号：US10030133B2
公开(公告)日：2018-07-24
申请号：US14363058
申请日：2012-11-20
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
Abstract: Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent.
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公开(公告)号：US20150189740A1
公开(公告)日：2015-07-02
申请号：US14414839
申请日：2013-07-18
Applicant: Kaneka Corporation
Inventor： Masayoshi Kido , Yoshihide Sekito
CPC classification number: H05K1/0281 , C08K3/22 , C09D5/004 , C09D7/61 , H05K1/0274 , H05K1/0373 , H05K2201/012 , H05K2201/2054
Abstract: The present invention provides a stiffener-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the stiffener from being detached during a reflow process. The stiffener-integrated flexible printed circuit board including: (A) a stiffener, (B) a thermosetting adhesive, (C) an insulator film, and (D) a wiring-pattern-equipped film, (A) the stiffener, (B) the thermosetting adhesive, (C) the insulator film, and (D) the wiring-pattern-equipped film being laminated in this order, (C) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.
Abstract translation: 本发明提供一种具有优异的电绝缘可靠性并且防止在回流过程中加强件脱离的加强件集成柔性印刷电路板。 所述加强件集成柔性印刷电路板包括：（A）加强件，（B）热固性粘合剂，（C）绝缘膜，（D）配线图案膜，（A）所述加强件，（B ）热固性粘合剂，（C）绝缘体膜，和（D）依次层叠配线图案的膜，（C）至少含有（a）粘合剂聚合物的绝缘膜和（b）黑色 着色剂具有在红外范围内的反射范围。
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