Invention Application
- Patent Title: DEPOSITION RING FOR THIN SUBSTRATE HANDLING VIA EDGE CLAMPING
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Application No.: US16951805Application Date: 2020-11-18
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Publication No.: US20220157572A1Publication Date: 2022-05-19
- Inventor: Abhishek CHOWDHURY , Edwin C. SUAREZ , Harisha SATHYANARAYANA , Nataraj BHASKAR RAO , Siqing LU
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/34 ; C23C14/35 ; C23C14/50 ; C23C16/458

Abstract:
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.
Public/Granted literature
- US12100579B2 Deposition ring for thin substrate handling via edge clamping Public/Granted day:2024-09-24
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