Invention Application
- Patent Title: DIMENSIONAL COMPENSATIONS FOR ADDITIVE MANUFACTURING
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Application No.: US17426580Application Date: 2019-04-30
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Publication No.: US20220161498A1Publication Date: 2022-05-26
- Inventor: Sergio Gonzalez Martin , Manuel Freire Garcia , Ismael Fernandez Aymerich
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/029833 WO 20190430
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y50/02

Abstract:
In an example, a method includes receiving, at least one processor, object model data representing at least a portion of a first object that is to be generated by an additive manufacturing apparatus by fusing build material within a fabrication chamber. An indication of an amount of fused build material in a region of the fabrication chamber which is to be below the region in which the first object is to be generated may be determined and a dimensional compensation value to apply to the object model data representing the first object may be determined based on the determined indication. The determined dimensional compensation value may be applied to the object model data to derive modified object model data.
Public/Granted literature
- US12109762B2 Dimensional compensations for additive manufacturing Public/Granted day:2024-10-08
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