Invention Application
- Patent Title: WAFER HANDLING CHAMBER WITH MOISTURE REDUCTION
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Application No.: US17670151Application Date: 2022-02-11
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Publication No.: US20220165595A1Publication Date: 2022-05-26
- Inventor: Petri Raisanen , Ward Johnson
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67 ; H01L21/302
Abstract:
An apparatus and method for reducing moisture within a wafer handling chamber is disclosed. The moisture reduction results in reduced oxidation of a wafer. The moisture reduction is made possible through use of valves and purging gas. Operation of the valves may result in improved localized purging.
Public/Granted literature
- US11837483B2 Wafer handling chamber with moisture reduction Public/Granted day:2023-12-05
Information query
IPC分类:
