Invention Application
- Patent Title: DIELECTRIC THIN FILM, CAPACITOR INCLUDING THE DIELECTRIC THIN FILM, AND METHOD FOR MANUFACTURING THE DIELECTRIC THIN FILM
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Application No.: US17306310Application Date: 2021-05-03
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Publication No.: US20220165840A1Publication Date: 2022-05-26
- Inventor: Hyungjun KIM , Changsoo LEE , Chan KWAK , Euncheol DO
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0159091 20201124
- Main IPC: H01L49/02
- IPC: H01L49/02

Abstract:
Provided is a method of preparing a dielectric film having a nanoscale three-dimensional shape and including an oxide, the oxide represented by RAMBOC where R is a divalent element and M is a pentavalent element, the method may include synthesizing a target material, the target material including the divalent element and the pentavalent element; and forming the oxide by depositing the divalent element and the pentavalent element, from the target material, onto a substrate such that the oxide includes a perovskite-type crystal structure, 1.3
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