ELECTRONIC DEVICE FOR CONFIGURING NEURAL NETWORK

    公开(公告)号:US20250014638A1

    公开(公告)日:2025-01-09

    申请号:US18891682

    申请日:2024-09-20

    Abstract: Disclosed are a first memory cell, a second memory cell, and a summing circuit. The first memory cell outputs only one of a first voltage through a first bit line and a second voltage through a second bit line, based on first input data received through a first word line and a second word line and a first weight. The second memory cell outputs only one of a third voltage through the first bit line and a fourth voltage through the second bit line, based on second input data received through a third word line and a fourth word line and a second weight; and the summing circuit generates an output voltage having a level corresponding to a sum of a level of a voltage received through the first bit line and a level of a voltage received through the second bit line.

    ARTIFICIAL NEURAL NETWORK CIRCUIT
    2.
    发明公开

    公开(公告)号:US20230153594A1

    公开(公告)日:2023-05-18

    申请号:US18094351

    申请日:2023-01-07

    CPC classification number: G06N3/063 G11C11/54 G06N3/04 G11C13/0069 G11C13/004

    Abstract: Provided is an artificial neural network circuit including unit weight memory cells including weight memory devices configured to store weight data and weight pass transistors, unit threshold memory cells including a threshold memory device programmed to store a threshold and a threshold pass transistor, a weight-threshold column in which the plurality of unit weight memory cells and the plurality of unit threshold memory cells are connected, and a sense amplifier configured to receive an output signal of the weight-threshold column as an input and receive a reference voltage as another input.

    SEMICONDUCTOR MANUFACTURING APPARATUS

    公开(公告)号:US20210035830A1

    公开(公告)日:2021-02-04

    申请号:US16821415

    申请日:2020-03-17

    Abstract: A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.

Patent Agency Ranking