Invention Application
- Patent Title: EPOXY-CONTAINING SILOXANE-MODIFIED RESIN, PACKAGE MATERIAL, AND PACKAGE STRUCTURE
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Application No.: US17133927Application Date: 2020-12-24
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Publication No.: US20220169800A1Publication Date: 2022-06-02
- Inventor: Wen-Bin CHEN , Ying-Nan CHAN , Kai-Chi CHEN , Chih-Hao LIN
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW109141971 20201130
- Main IPC: C08G77/00
- IPC: C08G77/00 ; C08L63/00 ; C09D163/00

Abstract:
An epoxy-containing siloxane-modified resin, a package material, and a package structure are provided. The epoxy-containing siloxane-modified resin is formed by reacting a hydroxy terminated siloxane compound with a siloxane resin, and then reacting with an epoxy silane. The hydroxy terminated siloxane compound and the siloxane resin have a molar ratio of 5:1 to 10:1, and the epoxy silane and the siloxane resin have a molar ratio of 2:1 to 4:1.
Public/Granted literature
- US1669110A Sight gauge for grain bins Public/Granted day:1928-05-08
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