Invention Application
- Patent Title: MULTILAYER CAPACITOR
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Application No.: US17307388Application Date: 2021-05-04
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Publication No.: US20220172898A1Publication Date: 2022-06-02
- Inventor: Jang Yeol LEE , Hye Min BANG , Tae Joon PARK , Hai Joon LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0162565 20201127
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/248 ; H01G4/012 ; H01G4/008

Abstract:
A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.
Public/Granted literature
- US11682527B2 Multilayer capacitor Public/Granted day:2023-06-20
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