公开(公告)号：US20230207213A1

公开(公告)日：2023-06-29

申请号：US17969176

申请日：2022-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Min CHO ,  Jang Yeol LEE ,  Ho Phil JUNG

IPC: H01G4/30 ,  H01G4/01 ,  H01G4/12 ,  H01G4/10 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/01 ,  H01G4/12 ,  H01G4/10 ,  H01G4/232

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and coating layers respectively covering the plating layer and including an island region exposing a portion of a surface of the plating layer.

公开(公告)号：US20220172898A1

公开(公告)日：2022-06-02

申请号：US17307388

申请日：2021-05-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Yeol LEE ,  Hye Min BANG ,  Tae Joon PARK ,  Hai Joon LEE

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/008

Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.

公开(公告)号：US20200082983A1

公开(公告)日：2020-03-12

申请号：US16179528

申请日：2018-11-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Soo KIM ,  Jang Yeol LEE ,  Jong Ho LEE

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G4/248

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes electrode layers electrically connected to the internal electrodes, and plating layers disposed on the electrode layers. At least one point, at which slopes of tangent lines of one of the electrode layers and the plating layers are opposite to each other, is disposed in a region within a range of ±0.2 BW around a point (0.5 BW) that is a halfway point of an overall width BW of the electrode layers disposed on the first surface or the second surface of the ceramic body.

公开(公告)号：US20200075248A1

公开(公告)日：2020-03-05

申请号：US16372782

申请日：2019-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Young CHOI ,  Jong Ho LEE ,  Eui Hyun JO ,  Jang Yeol LEE ,  Jin Woo LEE ,  Hyun Hee GU

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/18

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

公开(公告)号：US20200043668A1

公开(公告)日：2020-02-06

申请号：US16279189

申请日：2019-02-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong PARK ,  Jang Yeol LEE ,  Ji Hong JO

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  C04B37/00 ,  C04B35/468

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface, respectively; internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, and having one ends exposed to the third surface or the fourth surface; a first side margin portion and a second side margin portion disposed on sides of the internal electrodes exposed to the first and second surfaces; and adhesive layers disposed between the first surface of the ceramic body and the first side margin portion and between the first surface of the ceramic body and the second side margin portion, respectively. An average thickness of each of the first and second side margin portions is 2 μm or more and 10 μm or less.

公开(公告)号：US20190341192A1

公开(公告)日：2019-11-07

申请号：US16516612

申请日：2019-07-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Ra SHIN ,  Myeong Gi KIM ,  Eung Soo KIM ,  Hak Kwan KIM ,  Jang Yeol LEE ,  Seong Min CHIN

IPC: H01G4/30 ,  C04B35/634 ,  C04B35/468 ,  H01G4/12 ,  H01G4/008 ,  C08K3/04

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

公开(公告)号：US20220189700A1

公开(公告)日：2022-06-16

申请号：US17545289

申请日：2021-12-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Yeol LEE ,  Hye Min BANG ,  Bum Soo KIM

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 μm and a maximum thickness of the electrode layer is 5 to 20 μm.

公开(公告)号：US20200303123A1

公开(公告)日：2020-09-24

申请号：US16897615

申请日：2020-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Yeol LEE ,  Joon Hwan KWAG ,  Jong Ho LEE ,  Myung Jun PARK

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/005 ,  H01G4/12

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a sulfate-based secondary phase material disposed at a boundary between the plating layer and the electrode layer.

公开(公告)号：US20200075255A1

公开(公告)日：2020-03-05

申请号：US16274771

申请日：2019-02-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gwang Hyeon PARK ,  Jang Yeol LEE ,  Yong PARK ,  Hye Young CHOI ,  Jong Ho LEE ,  Ji Hong JO

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/008

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending ina thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

公开(公告)号：US20200043667A1

公开(公告)日：2020-02-06

申请号：US16169897

申请日：2018-10-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong PARK ,  Jang Yeol LEE ,  Ji Hong JO

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  C04B35/468 ,  C04B37/00

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface, respectively; internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, and having one ends exposed to the third surface or the fourth surface; a first side margin portion and a second side margin portion disposed on sides of the internal electrodes exposed to the first and second surfaces; and adhesive layers disposed between the first surface of the ceramic body and the first side margin portion and between the first surface of the ceramic body and the second side margin portion, respectively. An average thickness of each of the first and second side margin portions is 2 μm or more and 10 μm or less.