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公开(公告)号：US20180068798A1
公开(公告)日：2018-03-08
申请号：US15463652
申请日：2017-03-20
发明人： Kyo Yeol LEE , Yun Sung KANG , Hai Joon LEE , Dong Joon OH , Ho Phil JUNG , Seung Mo LIM
CPC分类号： H01G4/33 , H01G4/012 , H01G4/1227 , H01G4/1245
摘要： A thin film capacitor includes a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate. A thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer. Therefore, leakage current characteristics of the dielectric layers may be improved, and capacitance of the thin film capacitor may be secured.
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2.发明申请公开(公告)号：US20150021080A1
公开(公告)日：2015-01-22
申请号：US14149474
申请日：2014-01-07
发明人： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC分类号： H01G4/005 , H01G2/06 , H01G4/30 , H05K1/185 , H05K2201/10636 , Y02P70/611
摘要： There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body.
摘要翻译： 本发明提供一种嵌入板的多层陶瓷电子部件，包括：包含电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层; 分别设置在有源层上和下面的上和下覆盖层; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极，其中，位于所述第一电极中的最外侧位置的第一内部电极通过至少一个第一通孔连接到所述第一外部电极，所述至少一个第一通孔延伸至所述第一外部电极中的至少一个， 所述陶瓷体的第二主表面和位于所述第二内部电极中的最外侧位置的第二内部电极通过至少一个第二通孔延伸至所述第二外部电极的第一和第二主表面中的至少一个， 陶瓷体。
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公开(公告)号：US20180211776A1
公开(公告)日：2018-07-26
申请号：US15937008
申请日：2018-03-27
发明人： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC分类号： H01G2/06 , H01G4/012 , H01G4/232 , H01G4/30 , H05K1/185 , H05K3/0035 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≤tc≤20 μm may be satisfied.
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公开(公告)号：US20180061581A1
公开(公告)日：2018-03-01
申请号：US15485682
申请日：2017-04-12
发明人： Kyo Yeol LEE , Seung Mo LIM , Dong Joon OH , Yun Sung KANG , Hai Joon LEE
摘要： A thin film capacitor includes a capacitor body formed by alternately stacking first and second electrode layers and a dielectric layer on a substrate, and having the second electrode layer disposed in an uppermost portion thereof, and a stress alleviation layer formed on the uppermost second electrode layer. The stress alleviation layer is formed of a material having a coefficient of thermal expansion higher than those of the substrate and the dielectric layer.
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公开(公告)号：US20180033552A1
公开(公告)日：2018-02-01
申请号：US15728183
申请日：2017-10-09
发明人： Byoung Hwa LEE , Doo Young KIM , Hai Joon LEE , Jin Man JUNG
CPC分类号： H01G2/06 , H01G4/012 , H01G4/232 , H01G4/30 , H05K1/185 , H05K3/0035 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.
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6.发明申请EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开嵌入式多层陶瓷电子元件及其印刷电路板公开(公告)号：US20150098202A1
公开(公告)日：2015-04-09
申请号：US14269074
申请日：2014-05-02
发明人： Byoung Hwa LEE , Hai Joon LEE , Eun Hyuk CHAE , Bae Gen LEE , Jin Man JUNG
CPC分类号： H01G4/30 , H01G4/12 , H01G4/1227 , H01G4/232 , H05K1/185 , H05K2201/10636 , Y02P70/611
摘要： A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.
摘要翻译： 嵌入板中的多层陶瓷电子部件可以包括：包括电介质层的陶瓷体; 多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露; 以及分别形成在陶瓷体的两端部的第一外部电极和第二外部电极。 第一外部电极可以包括第一基极电极和第一端子电极，第二外部电极可以包括第二基极和第二端子电极，当第一外部电极的区域中的表面粗糙度为400nm时，可以满足Ra＆ 第一和第二端子电极中的50μm×50μm的面积被定义为Ra，当在第一和第二端子电极中的10μm×10μm的区域中的表面粗糙度时，可以满足130nm＆nlE; Ra'＆nlE; 400nm 被定义为Ra'。
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7.发明申请公开(公告)号：US20150053472A1
公开(公告)日：2015-02-26
申请号：US14135220
申请日：2013-12-19
发明人： Jin Woo LEE , Hai Joon LEE , Byoung Hwa LEE , Jin Man JUNG
CPC分类号： H05K1/185 , H01G2/06 , H01G4/232 , H05K3/3442 , H05K2201/10015
摘要： There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.
摘要翻译： 提供了一种嵌入式多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 多个第一和第二内部电极; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极，其中，所述第一外部电极和所述第二外部电极延伸到所述陶瓷体的第一和第二主面，并且当所述陶瓷体的厚度被定义为ts时， 形成在陶瓷体的第一和第二主表面上的第一和第二外部电极的最大厚度被定义为tb，在陶瓷体的第一和第二端面上形成的第一和第二外部电极的最小距离为一定长度 陶瓷体的方向被定义为ta，tb / ts和ta / tb分别满足以下等式：0.1＆nlE; tb / ts＆nlE; 1.0和0.5＆nlE; ta / tb＆nlE; 2.0。
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公开(公告)号：US20170338042A1
公开(公告)日：2017-11-23
申请号：US15369493
申请日：2016-12-05
发明人： Hyun Ho SHIN , Kyo Yeol LEE , Dong Joon OH , Woong Do JUNG , Ho Phil JUNG , Hai Joon LEE , Seung Mo LIM , Jong Bong LIM
摘要： A thin-film capacitor includes: a body in which a plurality of dielectric layers and first and second internal electrodes are alternately disposed on a substrate; and first and second external electrode disposed on an external surface of the body. A plurality of vias are disposed in the body, a first via connects first internal electrodes to each other, and penetrates from the external surface of the body to the lowermost first internal electrode, a second via connects second internal electrodes to each other, and penetrates from the external surface of the body to the lowermost second internal electrode, and the plurality of vias have a multistage shape, and at least one internal electrode has an etched portion of 0.3 to 0.7 layer in relation to one layer of the internal electrode.
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公开(公告)号：US20170250244A1
公开(公告)日：2017-08-31
申请号：US15271942
申请日：2016-09-21
发明人： Jong Pil LEE , Jong Bong LIM , Hai Joon LEE , Ji Hyun PARK
IPC分类号： H01L49/02 , H01L23/522 , H01L23/528
CPC分类号： H01L28/75 , H01L23/5222 , H01L23/5226 , H01L23/5283
摘要： A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.
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10.发明申请MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开埋在板上的多层陶瓷电子元件及其印刷电路板公开(公告)号：US20150075853A1
公开(公告)日：2015-03-19
申请号：US14135308
申请日：2013-12-19
发明人： Hai Joon LEE , Doo Young KIM , Byoung Hwa LEE , Jin Man JUNG
CPC分类号： H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/185 , H05K2201/09509 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied.
摘要翻译： 提供了一种嵌入板中的多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层，其间具有介电层，从而形成电容; 形成在有源层的上部和下部的上和下覆盖层; 以及形成在陶瓷体的两端的第一外部电极和第二外部电极，其中，所述第一外部电极包括形成在所述第一基底电极上的第一基极和第一端子电极，所述第二外部电极包括第二基极和第二端 形成在第二基极上的电极，并且在上覆盖层的厚度为tc1且下覆盖层的厚度为tc2，0.10＆nlE; tc1 / tc2＆nlE; 1.00的情况下，形成电极。
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