- 专利标题： ELECTRONIC COMPONENT
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申请号： US17469164申请日： 2021-09-08
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公开(公告)号： US20220181078A1公开(公告)日： 2022-06-09
- 发明人: Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2020-0168125 20201204
- 主分类号： H01G2/06
- IPC分类号： H01G2/06 ; H01G4/30 ; H01G4/232
摘要：
An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
公开/授权文献
- US11587729B2 Electronic component 公开/授权日：2023-02-21
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