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公开(公告)号：US11587729B2
公开(公告)日：2023-02-21
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US20220181078A1
公开(公告)日：2022-06-09
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US11837404B2
公开(公告)日：2023-12-05
申请号：US18098280
申请日：2023-01-18
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US20230154677A1
公开(公告)日：2023-05-18
申请号：US18098280
申请日：2023-01-18
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US11721481B2
公开(公告)日：2023-08-08
申请号：US17343321
申请日：2021-06-09
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A≤B≤0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.
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