Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
-
Application No.: US17111328Application Date: 2020-12-03
-
Publication No.: US20220181182A1Publication Date: 2022-06-09
- Inventor: Jenchun CHEN , Kuo Kai HUANG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/673
Abstract:
The present disclosure relates to an electronic component. The electronic component includes a first surface, a first functional region, and a non-functional region. The first functional region is disposed on the first surface of the electronic component. The non-functional region is recessed from the first surface of the electronic component.
Information query
IPC分类:
