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公开(公告)号：US20220181182A1
公开(公告)日：2022-06-09
申请号：US17111328
申请日：2020-12-03
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Kuo Kai HUANG
IPC: H01L21/683 , H01L21/673
Abstract: The present disclosure relates to an electronic component. The electronic component includes a first surface, a first functional region, and a non-functional region. The first functional region is disposed on the first surface of the electronic component. The non-functional region is recessed from the first surface of the electronic component.
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