Invention Application
- Patent Title: CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR CHIP
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Application No.: US17683979Application Date: 2022-03-01
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Publication No.: US20220183147A1Publication Date: 2022-06-09
- Inventor: Tomas Manuel Reiter , Mark Nils Muenzer , Andre Uhlemann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102018132143.0 20181213
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/473 ; H05K1/18 ; H05K7/20 ; H01L23/44

Abstract:
A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.
Public/Granted literature
- US11778735B2 Circuit board having a cooling area above and below a semiconductor chip Public/Granted day:2023-10-03
Information query