-
公开(公告)号：US20200153138A1
公开(公告)日：2020-05-14
申请号：US16673401
申请日：2019-11-04
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Mark Nils Muenzer , Marco Stallmeister
IPC: H01R13/05 , H01L23/538 , H01R13/24 , H01L23/00
Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.
-
公开(公告)号：US11502064B2
公开(公告)日：2022-11-15
申请号：US17177395
申请日：2021-02-17
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Christoph Koch , Mark Nils Muenzer
Abstract: Described is a power semiconductor module that includes: a frame made of an electrically insulative material; a first substrate seated in the frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a busbar extending from the first substrate through a side face of the frame; a current sensor module seated in a receptacle of the frame in sensing proximity of the busbar, the current sensor module including a current sensor attached to a circuit board; and a potting material fixing the current sensor module to the frame such that no air gap is present between the current sensor and the busbar. The potting material contacts the frame and the current sensor. Methods of producing the power semiconductor module are also described.
-
公开(公告)号：US20220262773A1
公开(公告)日：2022-08-18
申请号：US17177395
申请日：2021-02-17
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Christoph Koch , Mark Nils Muenzer
Abstract: Described is a power semiconductor module that includes: a frame made of an electrically insulative material; a first substrate seated in the frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a busbar extending from the first substrate through a side face of the frame; a current sensor module seated in a receptacle of the frame in sensing proximity of the busbar, the current sensor module including a current sensor attached to a circuit board; and a potting material fixing the current sensor module to the frame such that no air gap is present between the current sensor and the busbar. The potting material contacts the frame and the current sensor. Methods of producing the power semiconductor module are also described.
-
Patent Agency Ranking
公开(公告)号：US11316292B2
公开(公告)日：2022-04-26
申请号：US16673401
申请日：2019-11-04
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Mark Nils Muenzer , Marco Stallmeister
IPC: H01R13/05 , H01L23/538 , H01L23/00 , H01R13/24
Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.
-
公开(公告)号：US11778735B2
公开(公告)日：2023-10-03
申请号：US17683979
申请日：2022-03-01
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Mark Nils Muenzer , Andre Uhlemann
IPC: H05K1/02 , H05K1/18 , H01L23/473 , H01L23/44 , H05K7/20
CPC classification number: H05K1/0272 , H01L23/44 , H01L23/473 , H05K1/0203 , H05K1/185 , H05K7/20272 , H05K7/20927 , H05K2201/064 , H05K2201/09063 , H05K2201/10166
Abstract: A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.
-
公开(公告)号：US20220183147A1
公开(公告)日：2022-06-09
申请号：US17683979
申请日：2022-03-01
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Mark Nils Muenzer , Andre Uhlemann
IPC: H05K1/02 , H01L23/473 , H05K1/18 , H05K7/20 , H01L23/44
Abstract: A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.
-
7.发明授权公开(公告)号：US11266012B2
公开(公告)日：2022-03-01
申请号：US16711648
申请日：2019-12-12
Applicant: Infineon Technologies AG
Inventor： Tomas Manuel Reiter , Mark Nils Muenzer , Andre Uhlemann
IPC: H05K1/02 , H05K1/18 , H01L23/473 , H05K7/20 , H01L23/44
Abstract: A circuit board includes an electrically insulating part and an electrically conductive part. At least one semiconductor chip is embedded into the electrically insulating part in a part of the circuit board. Through openings in the part of the circuit board provide for passage of a cooling liquid. The through openings extend from a first surface of the circuit board to a second surface of the circuit board. The electrically conductive part includes a first outer conductive layer on the first surface and a second outer conductive layer on the second surface. The electrically conductive part also includes a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the part of the circuit board.
-
公开(公告)号：US20210057577A1
公开(公告)日：2021-02-25
申请号：US16991326
申请日：2020-08-12
Applicant: Infineon Technologies AG
Inventor： Christoph Koch , Sebastian Klauke , Mark Nils Muenzer
Abstract: A power semiconductor module includes a power semiconductor chip, an external contact electrically coupled to the power semiconductor chip, the external contact being configured to carry an alternating current and the external contact comprising an opening, and a current sensor assembly including a current sensor and being at least partially arranged in the opening, wherein the current sensor is configured to measure the alternating current.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.014 seconds)
