- 专利标题: MULTILAYER ELECTRONIC COMPONENT
-
申请号: US17545289申请日: 2021-12-08
-
公开(公告)号: US20220189700A1公开(公告)日: 2022-06-16
- 发明人: Jang Yeol LEE , Hye Min BANG , Bum Soo KIM
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2020-0174544 20201214
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/248 ; H01G4/232
摘要:
A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 μm and a maximum thickness of the electrode layer is 5 to 20 μm.
公开/授权文献
- US11955287B2 Multilayer electronic component 公开/授权日:2024-04-09
信息查询