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公开(公告)号：US20200082983A1
公开(公告)日：2020-03-12
申请号：US16179528
申请日：2018-11-02
发明人： Bum Soo KIM , Jang Yeol LEE , Jong Ho LEE
摘要： A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes electrode layers electrically connected to the internal electrodes, and plating layers disposed on the electrode layers. At least one point, at which slopes of tangent lines of one of the electrode layers and the plating layers are opposite to each other, is disposed in a region within a range of ±0.2 BW around a point (0.5 BW) that is a halfway point of an overall width BW of the electrode layers disposed on the first surface or the second surface of the ceramic body.
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公开(公告)号：US20210217560A1
公开(公告)日：2021-07-15
申请号：US16850557
申请日：2020-04-16
发明人： Bum Soo KIM , Jin Soo PARK , Duk Hyun CHUN , Myung Jun PARK , Yeon Song KANG , Jong Ho LEE , Hyun Hee GU
摘要： A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
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公开(公告)号：US20230154684A1
公开(公告)日：2023-05-18
申请号：US18097998
申请日：2023-01-17
发明人： Jin Soo PARK , Myung Jun PARK , Hyun Hee GU , Bum Soo KIM , Yeon Song KANG , Duk Hyun CHUN , Chung Eun LEE
CPC分类号： H01G4/2325 , H01G4/008 , H01G4/248 , H01G4/308 , H01G4/1227
摘要： A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
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公开(公告)号：US20220189700A1
公开(公告)日：2022-06-16
申请号：US17545289
申请日：2021-12-08
发明人： Jang Yeol LEE , Hye Min BANG , Bum Soo KIM
摘要： A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 μm and a maximum thickness of the electrode layer is 5 to 20 μm.
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公开(公告)号：US20220172895A1
公开(公告)日：2022-06-02
申请号：US17235350
申请日：2021-04-20
发明人： Jang Yeol LEE , Hye Min BANG , Bum Soo KIM
摘要： A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.
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公开(公告)号：US20210265114A1
公开(公告)日：2021-08-26
申请号：US15931042
申请日：2020-05-13
发明人： Jin Soo PARK , Myung Jun PARK , Hyun Hee GU , Bum Soo KIM , Yeon Song KANG , Duk Hyun CHUN , Chung Eun LEE
摘要： A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
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公开(公告)号：US20200321160A1
公开(公告)日：2020-10-08
申请号：US16910356
申请日：2020-06-24
发明人： Bum Soo KIM , Jang Yeol LEE , Jong Ho LEE
摘要： A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes electrode layers electrically connected to the internal electrodes, and plating layers disposed on the electrode layers. At least one point, at which slopes of tangent lines of one of the electrode layers and the plating layers are opposite to each other, is disposed in a region within a range of ±0.2 BW around a point (0.5 BW) that is a halfway point of an overall width BW of the electrode layers disposed on the first surface or the second surface of the ceramic body.
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