Invention Application
- Patent Title: FLICKER-MITIGATING PIXEL-ARRAY SUBSTRATE
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Application No.: US17118252Application Date: 2020-12-10
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Publication No.: US20220190019A1Publication Date: 2022-06-16
- Inventor: Yuanliang LIU , Bill PHAN , Duli MAO , Hui ZANG
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A flicker-mitigating pixel-array substrate includes a semiconductor substrate and a metal annulus. The semiconductor substrate includes a small-photodiode region. A back surface of the semiconductor substrate forms a trench surrounding the small-photodiode region in a cross-sectional plane parallel to a back-surface region of the back surface above the small-photodiode region. The metal annulus (i) at least partially fills the trench, (ii) surrounds the small-photodiode region in the cross-sectional plane, and (iii) extends above the back surface. A method for fabricating a flicker-mitigating pixel-array substrate includes forming a metal layer (i) in a trench that surrounds the small-photodiode region in a cross-sectional plane parallel to a back-surface region of the back surface above the small-photodiode region and (ii) on the back-surface region. The method also includes decreasing a thickness of an above-diode section of the metal layer located above the back-surface region.
Public/Granted literature
- US11710752B2 Flicker-mitigating pixel-array substrate Public/Granted day:2023-07-25
Information query
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