Invention Application
- Patent Title: Printed Circuit Board, Communications Device, and Manufacturing Method
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Application No.: US17689318Application Date: 2022-03-08
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Publication No.: US20220192007A1Publication Date: 2022-06-16
- Inventor: Wenliang Li , Zewen Wang , Xusheng Liu , Ertang Xie , Zhong Yan , Wang Xiong
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201910864686.1 20190909
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.
Public/Granted literature
- US12058808B2 Printed circuit board, communications device, and manufacturing method Public/Granted day:2024-08-06
Information query