发明申请
- 专利标题: CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME
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申请号: US17442665申请日: 2020-03-18
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公开(公告)号: US20220195270A1公开(公告)日: 2022-06-23
- 发明人: Ryosuke YAMAZAKI
- 申请人: DOW TORAY CO., LTD.
- 申请人地址: JP Shinagawa-ku, Tokyo
- 专利权人: DOW TORAY CO., LTD.
- 当前专利权人: DOW TORAY CO., LTD.
- 当前专利权人地址: JP Shinagawa-ku, Tokyo
- 优先权: JP2019-066556 20190329
- 国际申请: PCT/JP2020/012029 WO 20200318
- 主分类号: C09J183/04
- IPC分类号: C09J183/04 ; C08L83/04 ; C09J5/06 ; C09J7/35 ; C09J11/04 ; B29C45/00 ; B29C45/14 ; B29C43/00 ; B29C43/24 ; B29C43/28 ; B29C43/30
摘要:
Provided is a curable silicone composition and uses thereof. The composition which has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.