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公开(公告)号：US20220195270A1
公开(公告)日：2022-06-23
申请号：US17442665
申请日：2020-03-18
申请人： DOW TORAY CO., LTD.
发明人： Ryosuke YAMAZAKI
IPC分类号： C09J183/04 , C08L83/04 , C09J5/06 , C09J7/35 , C09J11/04 , B29C45/00 , B29C45/14 , B29C43/00 , B29C43/24 , B29C43/28 , B29C43/30
摘要： Provided is a curable silicone composition and uses thereof. The composition which has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.
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公开(公告)号：US20220195269A1
公开(公告)日：2022-06-23
申请号：US17442664
申请日：2020-03-18
申请人： DOW TORAY CO., LTD.
发明人： Ryosuke YAMAZAKI
IPC分类号： C09J183/04 , C08L83/04 , C09J5/06 , C09J7/35 , C09J11/04 , B29C45/00 , B29C45/14 , B29C43/00 , B29C43/24 , B29C43/30 , B29C43/28
摘要： Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to difficult-to-adhere to base materials, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A1) an organopolysiloxane resin having no hot-melt properties as a whole molecule and contains 20 mol % or more of a siloxane unit represented by SiO4/2, (A2) a liquid chain organopolysiloxane having at least two curing-reactive functional groups in the molecule, (B) a silatrane derivative or carbasilatrane derivative, (C) a curing agent, and (D) a functional inorganic filler. The content of component (D) is at least 10% by volume. The composition has hot-melt properties at a temperature of 200° C. or lower.
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公开(公告)号：US20240052106A1
公开(公告)日：2024-02-15
申请号：US18268222
申请日：2021-12-14
申请人： DOW TORAY CO., LTD.
CPC分类号： C08G77/12 , C08G77/08 , C08G77/20 , C08L83/04 , C08J3/28 , C09J183/04 , C08G2170/00 , C08G2190/00 , C08L2203/20 , C08L2205/025 , C08L2205/035 , C08L2312/06 , C08L2312/08
摘要： Provided is a hot-melt curable silicone composition with excellent hot dispensing properties and storage stability, which can be cured by triggering an external energy stimulus, and which provides excellent adhesive and mechanical properties to the cured product, and applications thereof. A curable silicone composition, including in a specific mass % range, comprises: (A) a non-hot-melt solid organopolysiloxane resin mixture; (B) a linear organopolysiloxane that is liquid at 25° C. having the same curing reactive functional group; (C) an organohydrogen polysiloxane; and (D) a hydrosilylation reaction catalyst that is inert at room temperature but is activated by an external energy stimulus. The whole composition has hot-melt properties, and the melt viscosity (flow tester measurement) at 100° C. is 50 Pa·s or less. A cured product thereof, and use in semiconductor applications and the like, is also provided. The composition is particularly suitable for use as an adhesive or sealing agent in hot dispensing applications.
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公开(公告)号：US20230044439A1
公开(公告)日：2023-02-09
申请号：US17788101
申请日：2020-12-28
申请人： DOW TORAY CO., LTD.
IPC分类号： C08L83/04 , C09J183/04 , C09J7/29 , B32B7/06 , B32B7/12 , B32B25/20 , B32B25/04 , B32B37/10 , B32B37/06
摘要： A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa·s or less.
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公开(公告)号：US20240043623A1
公开(公告)日：2024-02-08
申请号：US18013882
申请日：2021-06-21
申请人： DOW TORAY CO., LTD.
CPC分类号： C08G77/20 , C08G77/12 , C08G77/08 , C08K3/22 , H01L23/296 , C08K2003/2241 , C08K2201/003
摘要： Provided is a curable silicone composition that can be handled as a liquid at room temperature, where a cured product thereof has excellent adhesive and mechanical properties and exhibits relatively high hardness. The curable silicone composition comprises: (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond, (A2) an organopolysiloxane resin not having the curing reactive functional group, and (B) a linear organopolysiloxane in a liquid state at 25° C. having the curing reactive functional group, in specific mass % ranges, as well as (C) a curing agent. The viscosity of the entire composition is 50 Pa·s or less, and the amount of the curing reactive functional groups in 100 g of the composition is 1.5 mol % or more. Also provided is a cured product of the composition, and a use thereof in a semiconductor application and the like.
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公开(公告)号：US20220169894A1
公开(公告)日：2022-06-02
申请号：US17442656
申请日：2020-03-18
申请人： DOW TORAY CO., LTD.
IPC分类号： C09J7/35 , C08L83/04 , C09J183/04 , B29C45/00
摘要： To provide Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. A The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiO4/2 making up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.
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公开(公告)号：US20220064447A1
公开(公告)日：2022-03-03
申请号：US17418375
申请日：2019-12-27
申请人： DOW TORAY CO., LTD.
发明人： Ryosuke YAMAZAKI
摘要： Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.
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公开(公告)号：US20210189129A1
公开(公告)日：2021-06-24
申请号：US16756940
申请日：2018-10-15
申请人： DOW TORAY CO., LTD.
发明人： Ryosuke YAMAZAKI , Toru IMAIZUMI , Kouichi OZAKI
摘要： Provided is a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding and the like, and gives cured objects and the like highly inhibited from taking a color at high temperatures. The curable granular silicone composition comprises: (A) organopolysiloxane resin fine particles which do not have hot-melt properties and have a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO3/2 (where R is a monovalent organic group) or SiO4/2 account for at least 20 mol % of all the siloxane units; (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond; (C) a hardener; and (D) a functional filler. The composition as a whole has hot-melt properties. Uses of the curable granular silicone composition are also disclosed.
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公开(公告)号：US20230137947A1
公开(公告)日：2023-05-04
申请号：US17788121
申请日：2020-12-28
申请人： DOW TORAY CO., LTD.
发明人： Ryosuke YAMAZAKI , Kouichi OZAKI , Toru IMAIZUMI
摘要： A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.
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公开(公告)号：US20240052220A1
公开(公告)日：2024-02-15
申请号：US18268221
申请日：2021-12-14
申请人： DOW TORAY CO., LTD.
CPC分类号： C09J183/04 , C09J5/06 , C08G77/12 , C08G77/20 , C08G77/06 , H01L21/56 , C09J2483/00 , C08G77/70
摘要： Provided is a method of manufacturing a laminate body using a hot-melt curable silicone composition that is compatible with liquid dispensing by a dispenser, has excellent controllability of reaction due to suppressed curing reactivity at the dispensing temperature, wherein the curable silicone composition can be cured at high speed after dispensing. A method of manufacturing a laminate body, including a step of: dispensing a curable silicone composition having hot-melt properties as a whole, a melt viscosity at 100° C. (measured by a flow tester) of 50 Pa·s or less, and curable by irradiation with a high energy beam in a form filled in a dispensing cartridge onto a portion or all of a surface of at least one substrate; and optionally irradiating the composition with a high energy beam to cure the composition.
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