Invention Application
- Patent Title: ENCAPSULATION FOR TRANSITION METAL DICHALCOGENIDE NANOSHEET TRANSISTOR AND METHODS OF FABRICATION
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Application No.: US17133056Application Date: 2020-12-23
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Publication No.: US20220199838A1Publication Date: 2022-06-23
- Inventor: Chelsey Dorow , Kevin O'Brien , Carl Naylor , Uygar Avci , Sudarat Lee , Ashish Verma Penumatcha , Chia-Ching LIn , Tanay Gosavi , Shriram Shivaraman , Kirby Maxey
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/06 ; H01L23/29 ; H01L21/8238

Abstract:
A transistor includes a channel layer including a transition metal dichalcogenide (TMD) material, an encapsulation layer on a first portion of the channel layer, a gate electrode above the encapsulation layer, a gate dielectric layer between the gate electrode and the encapsulation layer. The transistor further includes a source contact on a second portion of the channel layer and a drain contact on a third portion of the channel layer, where the gate structure is between drain contact and the source contact.
Information query
IPC分类: