Invention Application
- Patent Title: LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE
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Application No.: US17557235Application Date: 2021-12-21
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Publication No.: US20220209079A1Publication Date: 2022-06-30
- Inventor: Kensuke YAMAOKA , Kenji OZEKI
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2020-217294 20201225,JP2021-128136 20210804
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62 ; H01L33/52 ; H01L33/00 ; H01L33/50

Abstract:
A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.
Information query
IPC分类: