- 专利标题: PROCESSING MODULE AND PROCESSING METHOD
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申请号: US17646571申请日: 2021-12-30
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公开(公告)号: US20220216073A1公开(公告)日: 2022-07-07
- 发明人: Kiyoshi Mori , Takayuki Yamagishi
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 优先权: JP2021-001650 20210107
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/677 ; H01L21/687
摘要:
A processing module includes: a processing container including therein processing spaces in which stages are disposed, respectively, wherein a center of each of the processing spaces is located on a same circumference; a rotation arm including holders configured to hold wafers, which are placed on the stages of the processing spaces, respectively, wherein the rotation arm is rotatable around a center of the circumference as a rotation axis; and a sensor located between adjacent processing spaces and configured to detect positions of the wafers held by the rotation arm during rotational operation of the rotation arm.
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