Invention Application
- Patent Title: THREE-DIMENSIONAL OBJECT FORMATION
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Application No.: US17311421Application Date: 2019-10-11
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Publication No.: US20220226892A1Publication Date: 2022-07-21
- Inventor: Aja Hartman , John Samuel Dilip Jangam , Lihua Zhao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/055802 WO 20191011
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F10/14 ; B22F3/10 ; B22F1/105
Abstract:
A kit for three-dimensional printing a metal object is described. The kit comprises a build material and a shaping composition. The build material comprises metallic particles. The shaping composition comprises a metallic mixture for forming an intermetallic compound with the metallic particles and/or that is exothermically reactive.
Public/Granted literature
- US12103073B2 Three-dimensional object formation Public/Granted day:2024-10-01
Information query
