Invention Application
- Patent Title: POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM
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Application No.: US17152084Application Date: 2021-01-19
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Publication No.: US20220230938A1Publication Date: 2022-07-21
- Inventor: Anthony M. Coppola , Alireza Fatemi , Ronald O. Grover, JR. , Ming Liu , Chih-hung Yen
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L21/48

Abstract:
A vascular jet cooling system for use with a planar power module and a coolant supply includes a manifold housing and one or more jet impingement plates. The manifold housing is constructed of a dielectric polymer molding material, and defines a coolant inlet port configured to fluidly connect to the coolant supply, an internal cavity in fluid communication with the coolant inlet port and containing the power module, and a coolant outlet port in fluid communication with the internal cavity. The jet impingement plate(s) is arranged in the internal cavity. Openings of the plates direct coolant passing through the coolant inlet port onto a respective major surface of the power module. A power module assembly includes a planar power module and the vascular jet cooling system. A method of constructing the power module assembly uses sacrificial materials and overmolding of the jet impingement plates.
Information query
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