Invention Application
- Patent Title: CAMERA MODULE
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Application No.: US17213836Application Date: 2021-03-26
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Publication No.: US20220232147A1Publication Date: 2022-07-21
- Inventor: MING-HSUN LEE
- Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- Applicant Address: CN Shenzhen
- Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- Current Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN202110064272.8 20210118
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B17/02 ; H05K1/11 ; H05K3/32
Abstract:
A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.
Public/Granted literature
- US11736785B2 Camera module Public/Granted day:2023-08-22
Information query
