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公开(公告)号:US20220019116A1
公开(公告)日:2022-01-20
申请号:US17375317
申请日:2021-07-14
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: MING-HSUN LEE , YEN-LIN PENG
IPC: G02F1/157 , G02F1/155 , G03B30/00 , G02F1/1333
Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.
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公开(公告)号:US20220232147A1
公开(公告)日:2022-07-21
申请号:US17213836
申请日:2021-03-26
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: MING-HSUN LEE
Abstract: A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.
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公开(公告)号:US20200344368A1
公开(公告)日:2020-10-29
申请号:US16506224
申请日:2019-07-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: YING-LIN CHEN , MING-HSUN LEE
Abstract: An image processing device able to receive image and other data wirelessly for more reliable communication includes at least one a camera module and at least one a processing module. The camera module includes a lens, an image sensor configured for converting the captured light into electrical signals and a first integrated unit. The at least one processing module includes a processor configured for generating signals of an image according to the electrical signals, and a second integrated unit. The first integrated unit and the second integrated unit establish a non-contact wireless communication connection therebetween, thereby realizing communicating between the camera module and the processing module.
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公开(公告)号:US20240223913A1
公开(公告)日:2024-07-04
申请号:US18225247
申请日:2023-07-24
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: MING-HSUN LEE , YEN-LIN PENG
IPC: H04N23/75 , G02F1/1343 , G02F1/155 , H04N23/55 , H04N23/63
CPC classification number: H04N23/75 , G02F1/13439 , G02F1/155 , H04N23/55 , H04N23/632
Abstract: An image acquisition device includes an optical sensor and a dimmer. The optical sensor includes a photosensitive area configured to convert optical signal into image signal. The dimmer is on a side of the optical sensor that receives the optical signal. The dimmer completely covers the photosensitive area. The dimmer is configured for modulating intensity of the optical signal projected onto the optical sensor. The dimmer includes dimming blocks. Each dimming block is configured for modulating intensity of light projected onto a portion of the photosensitive area. An electronic device and an image acquisition method are also provided.
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公开(公告)号:US20240219817A1
公开(公告)日:2024-07-04
申请号:US18237845
申请日:2023-08-24
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: MING-HSUN LEE , YI-WAN WANG
CPC classification number: G03B17/55 , H04N23/52 , H04N23/54 , H05K7/2039
Abstract: A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.
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公开(公告)号:US20240107666A1
公开(公告)日:2024-03-28
申请号:US18070344
申请日:2022-11-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: MING-HSUN LEE , CHEN-EN LIN
CPC classification number: H05K1/0298 , H05K1/184 , H05K2201/10651
Abstract: A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.
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