ELECTROCHROMIC MODULE, CAMERA MODULE, AND ELECTRONIC DEVICE

    公开(公告)号:US20220019116A1

    公开(公告)日:2022-01-20

    申请号:US17375317

    申请日:2021-07-14

    Abstract: An electrochromic module includes two opposite positioned first substrates and at least one electrochromic unit disposed between the first substrates. Each of the electrochromic unit includes a first conductive layer, a filter layer, and a second conductive layer stacked in turn. One end of the first conductive layer protrudes from an edge of the filter layer to form a first electrode area. One end of the second conductive layer protrudes from another edge of the filter layer to form a second electrode area. Vertical projections of the first electrode area and the second electrode area on the first substrates are spaced apart from each other. Each of the first electrode area and the second electrode area is configured to connect to a power supply. The electrochromic module can make it easy to connect the electrochromic unit to the power supply.

    IMAGE PROCESSING DEVICE COMMUNICATING WIRELESSLY AND ELECTRONIC DEVICE USING THE SAME

    公开(公告)号:US20200344368A1

    公开(公告)日:2020-10-29

    申请号:US16506224

    申请日:2019-07-09

    Abstract: An image processing device able to receive image and other data wirelessly for more reliable communication includes at least one a camera module and at least one a processing module. The camera module includes a lens, an image sensor configured for converting the captured light into electrical signals and a first integrated unit. The at least one processing module includes a processor configured for generating signals of an image according to the electrical signals, and a second integrated unit. The first integrated unit and the second integrated unit establish a non-contact wireless communication connection therebetween, thereby realizing communicating between the camera module and the processing module.

    CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240107666A1

    公开(公告)日:2024-03-28

    申请号:US18070344

    申请日:2022-11-28

    CPC classification number: H05K1/0298 H05K1/184 H05K2201/10651

    Abstract: A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.

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