Invention Application
- Patent Title: TRENCH GATE TRANSISTORS WITH LOW-RESISTANCE SHIELD AND GATE INTERCONNECTS
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Application No.: US17248426Application Date: 2021-01-25
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Publication No.: US20220238427A1Publication Date: 2022-07-28
- Inventor: Prasad VENKATRAMAN , Gary Horst LOECHELT
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L29/40 ; H01L29/423

Abstract:
In a general aspect, a transistor can include a trench disposed in a semiconductor region and a gate electrode disposed in an upper portion of the trench. The gate electrode can include a first and second gate electrode segments. The transistor can also include a shield electrode having a first shield electrode portion disposed in a lower portion of the trench, and a second shield electrode portion orthogonally extending from the first shield electrode portion in the lower portion of the trench to the upper portion of the trench. The first shield electrode portion can be disposed below the first and second gate electrode segments, and the second shield electrode portion can being disposed between the first and second gate electrode segments. The transistor can also include a patterned buried conductor layer. The first and second gate electrode segments can be electrically coupled via the patterned buried conductor layer.
Public/Granted literature
- US11552017B2 Trench gate transistors with low-resistance shield and gate interconnects Public/Granted day:2023-01-10
Information query
IPC分类: