Invention Application
- Patent Title: GATE STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
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Application No.: US17232282Application Date: 2021-04-16
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Publication No.: US20220238688A1Publication Date: 2022-07-28
- Inventor: Hsin-Yi Lee , Weng Chang , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/40 ; H01L29/66 ; H01L21/285

Abstract:
A semiconductor device a method of forming the same are provided. The semiconductor device includes a gate stack over an active region of a substrate. The gate stack includes a gate dielectric layer and a first work function layer over the gate dielectric layer. The first work function layer includes a plurality of first layers and a plurality of second layers arranged in an alternating manner over the gate dielectric layer. The plurality of first layers include a first material. The plurality of second layers include a second material different from the first material.
Public/Granted literature
- US11824100B2 Gate structure of semiconductor device and method of forming same Public/Granted day:2023-11-21
Information query
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