Invention Application
- Patent Title: TILE-BASED PHASED-ARRAY ARCHITECTURE FOR MULTI-BAND PHASED-ARRAY DESIGN AND COMMUNICATION METHOD
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Application No.: US17235415Application Date: 2021-04-20
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Publication No.: US20220247077A1Publication Date: 2022-08-04
- Inventor: Venumadhav BHAGAVATULA , Siu-Chuang Ivan LU , Sang Won SON
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Main IPC: H01Q5/307
- IPC: H01Q5/307 ; H01Q5/42 ; H01Q5/50 ; H04B1/44

Abstract:
A radio frequency integrated circuit (RFIC) and method of communication are provided. The RFIC includes phased-locked loop (PLL) and data stream circuitry and a plurality of tiles in communication with the PLL and data stream circuitry. The plurality of tiles includes comprising at least one tile for each frequency band of the RFIC. The plurality of tiles are configured to communicate a data stream signal between tiles in a cascading sequence. Each tile of the plurality of tiles includes a plurality of up/down conversion mixers for converting the data stream signal between an intermediate frequency (IF) and a radio frequency (RF). Each tile also includes a plurality of front end (FE) elements, each in communication with a corresponding antenna and an up/down conversion mixer of the plurality of up/down conversion mixers.
Public/Granted literature
- US12113301B2 Tile-based phased-array architecture for multi-band phased-array design and communication method Public/Granted day:2024-10-08
Information query