Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, AND RELATED MODULE, CIRCUIT, AND PREPARATION METHOD
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Application No.: US17591016Application Date: 2022-02-02
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Publication No.: US20220254877A1Publication Date: 2022-08-11
- Inventor: Wentao YANG , Loucheng DAI , Chaofan SONG , Huiling ZUO , Jiang DU , Zhaozheng HOU , Boning HUANG
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN202110170393.0 20210207
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/739

Abstract:
A semiconductor device, and a related module, circuit, and preparation method are disclosed. The device includes an N-type drift layer, a P-type base layer, N-type emitter layers, gates, a field stop layer, a P-type collector layer, and the like. The field stop layer includes a first doped region and a second doped region that are successively stacked on a surface of the N-type drift layer. A particle radius of an impurity in the first doped region is less than a particle radius of an impurity in the second doped region. Doping densities of both the first doped region and the second doped region are higher than a doping density of the N-type drift layer. According to the semiconductor device, a collector-emitter leakage current of an IGBT can be effectively reduced.
Information query
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