Invention Application
- Patent Title: HIGH-ENTROPY ALLOY FILM AND MANUFACTURING METHOD THEREOF
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Application No.: US17368987Application Date: 2021-07-07
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Publication No.: US20220259706A1Publication Date: 2022-08-18
- Inventor: Jyh-Wei Lee , Bih-Show Lou , Yung-Chin Yang , Hsin Chao
- Applicant: MING CHI UNIVERSITY OF TECHNOLOGY
- Applicant Address: TW NEW TAIPEI
- Assignee: MING CHI UNIVERSITY OF TECHNOLOGY
- Current Assignee: MING CHI UNIVERSITY OF TECHNOLOGY
- Current Assignee Address: TW NEW TAIPEI
- Priority: TW110105287 20210217
- Main IPC: C22C30/00
- IPC: C22C30/00 ; C23C14/16 ; C23C14/35

Abstract:
A high-entropy alloy film, the composition of which includes titanium, zirconium, niobium, tantalum and iron. The high-entropy alloy film is made with a combination of elements with high biocompatibility, and its formation of non-crystalline structure is further improved by adding iron. Furthermore, as the content of titanium in the high-entropy alloy film is adjusted, the microstructure, mechanical properties, and corrosion resistance of the high-entropy alloy film is changed as well.
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