Invention Application
- Patent Title: SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE
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Application No.: US17736204Application Date: 2022-05-04
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Publication No.: US20220260397A1Publication Date: 2022-08-18
- Inventor: Volker Strutz , Rainer Markus Schaller
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102018119677.6 20180814
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01R33/07

Abstract:
A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.
Public/Granted literature
- US11662232B2 Sensor package and method for producing a sensor package Public/Granted day:2023-05-30
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