- 专利标题: FIELD PLATE STRUCTURE FOR HIGH VOLTAGE DEVICE
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申请号: US17735369申请日: 2022-05-03
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公开(公告)号: US20220262908A1公开(公告)日: 2022-08-18
- 发明人: Chia-Cheng Ho , Hui-Ting Lu , Pei-Lun Wang , Yu-Chang Jong , Jyun-Guan Jhou
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L27/092 ; H01L29/78 ; H01L29/49 ; H01L29/66 ; H01L21/28 ; H01L21/765 ; H01L21/8238
摘要:
Various embodiments of the present disclosure are directed towards an integrated chip comprising a gate electrode disposed on a substrate between a pair of source/drain regions. A dielectric layer is over the substrate. A field plate is disposed on the dielectric layer and laterally between the gate electrode and a first source/drain region in the pair of source/drain regions. The field plate comprises a first field plate layer and a second field plate layer. The second field plate layer extends along sidewalls and a bottom surface of the first field plate layer. The first and second field plate layers comprise a conductive material.